new-10%

HSB27-434316

Номер детали производителя:HSB27-434316

Производитель:CUI Devices

Описание:HEAT SINK, BGA, 43.1 X 43.1 X 16

Техническая спецификация:HSB27-434316 Техническая спецификация

Статус RoHs:compliant

Пакет кейсов:-

Shipped from:HongKong/Shenzhen Warehouse

Delivery:DHL/Fedex/UPS/TNT/SF/EMS

Количество	Цена за единицу товара	Цена внешн.
1	$2.60000	$2.6
500	$2.574	$1287
1000	$2.548	$2548
1500	$2.522	$3783
2000	$2.496	$4992
2500	$2.47	$6175

В наличии: 1103 items

Upload BOM File

HSB27-434316 Purchase Assurance: Buy Confidently, Use Securely

Transparent & Traceable Sources

We source exclusively from verified channels to ensure authenticity:

Direct from manufacturer and OEMs
Authorized distributors
Market-vetted traders (3+ years stable supply)

Every batch is traceable with documented proof of origin.

Quality Inspection Process

We enforce strict checks to ensure components meet standards:

Visual: Appearance, markings, packaging, batch codes
X-ray: Pad consistency (on request)
Function test: Sample checks for specific models (upon request)
Reports: Available upon request

Flexible Payments & Terms

We adapt to your project needs:

T/T, PayPal, Credit Card
Credit terms for long-term partners (e.g., monthly, Net 15/30)

Reliable After-Sales Support

365 Days warranty with streamlined solutions:

Defective? Free returns/replacements
Fast reshipment or refund
Full-service sourcing: Procurement & payment support

Оптовые цены на каждый заказ, большой или маленький

Технические характеристики
Техническая спецификация

HSB27-434316 CUI Devices

Name: HSB27-434316
Brand: ICHome Technology
SKU: HSB27-434316
Price: 0.001 USD
Availability: InStock
Rating: 98 (19808 reviews)

Имя	Ценить
статус продукта	Active
тип	Top Mount
пакет охлажденный	BGA
метод крепления	Adhesive
форма	Square, Pin Fins
длина	1.697" (43.10mm)
ширина	1.697" (43.10mm)
диаметр	-
высота плавника	0.650" (16.51mm)
рассеиваемая мощность при повышении температуры	8.98W @ 75°C
Тепловое сопротивление при принудительном потоке воздуха	2.80°C/W @ 200 LFM
тепловое сопротивление @ естественное	8.35°C/W
материал	Aluminum Alloy
материал отделки	Black Anodized

Q1: What is the purchase guide for HSB27-434316?: HSB27-434316 of CUI Devices is a HEAT SINK, BGA, 43.1 X 43.1 X 16. ICHOME is a long-term spot supplier of HSB27-434316, supporting sample purchase and bulk order.

Q2: How to find the detailed information of HSB27-434316?: Download HSB27-434316 Техническая спецификация

Q3: What payment can support in ICHOME?: PayPal, Payoneer, Visa, Bank Transfer, AliExpress.

Q4: Where do you sourcingHSB27-434316 from?: After 21 years of long-term and stable development, ICHOME have accumulated leading supply chain partner.

Q5: Can you provide HSB27-434316 alternative/replacement suggestions?: Through different levels of industry applications, ICHOME engineers will analyze component risks (discontinued, single source, etc.) and give you HSB27-434316 replacement suggestions, and then provide you with alternative products, supporting free sample delivery.

Q6: Why choose ICHOME?: Compared with ordinary agents, ICHOME provides full BOM matching, EOL judgment, alternative model suggestions, large stock + flexible procurement, test reports, return service